Broadcom and TOPPAN Open Singapore’s First High-End FC-BGA Plant
Advanced Substrate Technologies (AST), a joint venture between Broadcom and Japan’s TOPPAN, has opened Singapore’s first manufacturing facility capable of producing high-end FC-BGA substrates. The plant in the Jurong Lake District will manufacture large-body, high-layer-count substrates for AI computing, networking and high-performance computing applications.
The facility is also TOPPAN’s first FC-BGA substrate production site outside Japan. Broadcom is both AST’s joint-venture partner and its primary customer, giving the chipmaker additional access to substrate capacity as shortages affect the supply chain for advanced AI and networking hardware.
New Plant Adds Advanced Substrate Capacity
The facility covers approximately 95,000 square metres and is designed to manufacture high-density FC-BGA substrates. These components sit between semiconductor chips and circuit boards, providing the dense electrical connections required by advanced processors and other high-performance devices.
AST plans to begin high-value manufacturing toward the end of 2026 and scale production as demand develops. The site also includes research and development operations alongside manufacturing.
AI and Networking Drive Substrate Demand
Advanced substrates have become an increasingly important part of the AI hardware supply chain. AI accelerators and networking chips require packages capable of handling large numbers of high-speed connections as computing performance increases.
AST is specifically targeting large-body, high-layer-count FC-BGA substrates for AI computing and networking equipment. Broadcom said the Singapore capacity will provide additional flexibility as demand for AI and networking silicon continues to grow.
Singapore Expands Its Semiconductor Capabilities
The new facility adds advanced substrate manufacturing to Singapore’s existing semiconductor ecosystem, which includes chip design, wafer fabrication, equipment manufacturing and advanced packaging.
Singapore’s Ministry of Trade and Industry said the AST facility is the country's first to manufacture high-end FC-BGA substrates. The project is expected to create more than 330 jobs, including engineering and skilled technician positions.
TOPPAN Diversifies Production Beyond Japan
For TOPPAN, the Singapore facility provides its first overseas production base for FC-BGA substrates. The company’s existing production hub is located at its Niigata facility in Japan.
The additional location is intended to strengthen supply-chain resilience while bringing production closer to customers across the Asia-Pacific region. TOPPAN also aims to increase its FC-BGA production capacity to at least 2.5 times its fiscal 2022 level by the end of fiscal 2027.
Manufacturing and R&D Under One Facility
AST is combining production with research and development at the Singapore site. The company is expected to work with local research institutions and industry partners on future substrate technologies.
The facility also incorporates sustainability measures including solar power and water-recycling systems, according to TOPPAN and Singapore authorities.
The new plant adds capacity at a critical point in the semiconductor supply chain, giving Broadcom and TOPPAN a Singapore-based manufacturing operation focused on the advanced substrates required by next-generation AI and networking systems.
