SEMICON India 2026 Records 25 Semiconductor Deals as India Expands Chip Ecosystem
SEMICON India 2026 recorded 25 major announcements and collaborations on its second day, bringing together Indian and global companies across almost every major segment of the semiconductor value chain. The agreements cover manufacturing, critical materials, advanced packaging, chip design, power electronics, logistics and specialised workforce development.
The developments come as India works to build a more integrated semiconductor ecosystem under the India Semiconductor Mission (ISM), while attracting international companies and investment into domestic chip manufacturing and related technologies.
Tata Electronics Expands Local Semiconductor Supply Chain
Several announcements focused on strengthening the domestic supply chain for semiconductor manufacturing. Tata Electronics signed agreements with INOX Air Products for high-purity gases, Sumitomo Chemical for high-purity wet chemicals and advanced materials, and Kelington Engineering for gas distribution systems, high-purity piping and process-tool connections.
Tata Electronics also partnered with Japan’s Enomoto on advanced semiconductor packaging and lead-frame manufacturing. A separate strategic partnership with L&T Semiconductor Technologies will explore manufacturing L&T products at Tata’s fab and OSAT facilities, initially focusing on consumer-grade camera modules.
Power Electronics and AI Infrastructure Get New Focus
The announcements also extended into Silicon Carbide power electronics, renewable energy and AI data centres. L&T Semiconductor Technologies partnered with Newen Systems to develop Silicon Carbide power modules for renewable energy systems and AI data centres.
Another collaboration involving MeitY, the Ministry of Power and POWERGRID will support indigenous Silicon Carbide power modules for voltage-source-converter-based HVDC systems. The technology is planned for a pilot at POWERGRID’s 1,000 MW Pusauli project in Bihar.
India Pushes Indigenous Chip Design and Packaging
SEMICON India 2026 also highlighted efforts to move Indian semiconductor design closer to finished products. IndieSemiC and C-DAC launched the ISC-VEGA-SOM, described by the government as India’s first indigenous System-on-Module. It combines C-DAC’s VEGA-Thejas32 processor with IndieSemiC’s LoRa RF module.
Kaynes Semicon and IndieSemiC separately announced an OSAT partnership covering advanced package qualification, assembly and testing, including QFN and BGA packages. Kaynes Semicon, Microchip Technology and GridCrest Technologies will also explore an India-based pathway for energy-metering system-on-chips.
Workforce Development Becomes a Key Part of the Push
The 25 announcements also included several initiatives aimed at addressing the specialised talent requirements of India’s semiconductor industry. NIELIT announced partnerships with Siemens EDA, Tata Electronics, Singapore Polytechnic International, IESA and SEMI University covering semiconductor design education, training, certification and workforce development.
NIELIT and SCL also launched an indigenous 0.8-micron open-source Process Design Kit (PDK) on the NIELIT eChipHub platform, giving students and innovators access to tools for semiconductor design.
Global Participation Grows at SEMICON India
The scale of international participation was another focus of the event. More than 600 exhibitors, including around 300 international exhibitors, are participating in SEMICON India 2026. Japan and Singapore each had more than 30 companies represented through their country pavilions, alongside participation from South Korea and European countries including Belgium, the Netherlands and Sweden.
Union Electronics and IT Minister Ashwini Vaishnaw said the participation and business-to-business engagement reflected growing international interest in expanding semiconductor activities in India. He also highlighted water recycling in semiconductor fabs and closed-loop cooling in data centres as important sustainability measures as the sector expands.
India’s Semiconductor Strategy Moves Beyond Chipmaking
The announcements show that India’s semiconductor push is extending beyond fabs and chip design into materials, equipment, packaging, logistics, power electronics and workforce development. Vaishnaw said the next phase of the India Semiconductor Mission would focus on design, machines and materials, additional fabs, ATMP/OSAT, R&D and talent development.
SEMICON India 2026 is being held at Yashobhoomi in New Delhi from September 17 to 19, bringing together companies, policymakers, researchers, startups and academic institutions from across the semiconductor industry.
